TSMC VP of advanced packaging technology Xu Guojin said opti
文 / 小金
2026-08-31 12:01:21
来源:亚金网
TSMC VP of advanced packaging technology Xu Guojin said optical-transceiver architectures are undergoing a structural shift and silicon photonics has become the mainstream. He expects silicon photonics could exceed 50% market share by 2027, will ultimately take the form of co-packaged optics (CPO), and some vendors will begin volume production in H2 this year.
